Water cooler for direct‑die mounting on AMD AM5 CPUs featuring a nickel‑plated copper cold plate, a hybrid microfin structure with a jet plate for optimized flow and integrated ARGB lighting.

The AMD Mycro Direct-Die Pro is engineered for delidded AM5 processors, replacing the SAM and heatspreader to sit directly on the silicon while the nickel plating limits gallium-based liquid metal diffusion and the hybrid fin design reduces flow resistance.

• Direct‑die mounting for delidded CPUs (requires removal of Socket Actuation Mechanism)


• Nickel‑plated copper cold plate with two sizes of microfins and jet plate


• Annealed acrylic under an anodized aluminum cover to prevent stress cracks


• Digital ARGB LEDs under the cover, controlled via 3‑pin ARGB header (+5V/DATA/GND); LEDs illuminate the acrylic and G1/4 connectors


• G1/4‑inch connections for coolant lines


• Compatibility: generally compatible with Ryzen 9000 series including X3D variants; not compatible with Ryzen 5 7400F or Ryzen 8000G APUs (As of September 2025)


• Includes insulation sheet, 600 mbar pressure test report, mounting screws and wrenches

Provides direct‑die cooling with optimized flow and integrated lighting while the nickel plating reduces the need for repeated liquid‑metal applications.

Vloeibaar metaal thermische pasta applicator (pakket van 3)

Thermal Grizzly TG Remove is een op aceton gebaseerde nanoreiniger voor de beste reinigingsresultaten van thermische pasta. Bovendien heeft TG Remove een ontvettend effect dat helpt bij het voorbereiden van het oppervlak voor nieuwe toepassingen, bijvoorbeeld op CPU's.

Thermische' plaat, thermische geleidbaarheid: 8 W (mK), 100 x 100 x 2 mm, verpakking van 1 stuk

Thermische pasta, lichtgrijs

Thermische pasta, Thermal Grizzly Duronaut Pro 6g, combineert uitstekende thermische geleidbaarheid, extreme stabiliteit op lange termijn, elektrische niet-geleiding en geen uitharding na verloop van tijd voor veeleisende PC- en industriële koelsystemen.

De speciaal ontwikkelde siliconenolie, aluminium micropoeder en zinkoxide nanopoeder helpen het pump-out-effect te minimaliseren, de hechting aan het oppervlak te verbeteren en de thermische contactweerstand te verlagen.

De verpakking bevat Duronaut Pro 6g, een applicator, TG Spatula en TG Spatula Pro voor efficiënt uitsmeren in dunne aanbrenglagen.

Ideaal voor gamers, overclockers en veeleisende koelopstellingen die duurzame, efficiënte warmteoverdracht tussen CPU en koeler nodig hebben.

Thermische pasta Thermal Grizzly Duronaut Pro biedt uitstekende thermische geleidbaarheid, extreme stabiliteit op lange termijn, elektrisch niet-geleidend gebruik en geen uitharding na verloop van tijd.

Duronaut Pro is een high-end thermische pasta ontwikkeld voor gamers, overclockers en veeleisende industriële koelsystemen, met siliconenolie met aluminium micropoeder en zinkoxide nanopoeder.

• Minimaliseert het pump-out-effect met geoptimaliseerde deeltjesvorm en -grootte
• Ondersteunt dunne aanbrenglagen voor lage thermische contactweerstand
• Inclusief applicator, TG Spatula en TG Spatula Pro
• Inhoud: 2 g

Ontworpen voor efficiënte warmteoverdracht tussen warmtebron en koeler; Duronaut Pro helpt betrouwbare koelprestaties in de loop van de tijd te behouden.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly presents the WireView GPU, a device for measuring the power consumption of PCI expansion and plug-in cards, which was developed in collaboration with Jon „elmor“ Sandström. At the same time, the U-shaped design of the adapter enables optimised cable routing for clean cable management.

What does the WireView GPU do?
The WireView GPU enables the measurement of the power consumption of PCI expansion and plug-in cards and logs this data to determine the power consumption. This data can be used, among other things, to determine the power costs of a graphics card or to compare the power consumption with other graphics cards - and just plain looks cool!

- 3 x 8-Pins PCI-E - normal direction

The practical AM5 Adapter & Offset Mounting Kit for AMD‘s socket AM5 motherboards includes cooler brackets for offset mounting of the CPU as well as adapter screws from UNC 6-32 to M3 and M4 threads respectively. The adapter screws can be used to mount CPU coolers that require an M3 or M4 thread instead of the UNC 6-32 thread of the mounting screws of the cooler bracket, as is the case with various AIOs or water coolers. With the offset brackets, compatible CPU coolers can optionally be mounted offset on the processor to optimise cooling performance. Since the introduction of the chiplet design in Ryzen CPUs, the hottest point of the heat spreader is no longer in the middle, but has been offset slightly downwards and, depending on the CPU, towards the edge.

Thermal Grizzly presents the WireView GPU, a device for measuring the power consumption of PCI expansion and plug-in cards, which was developed in collaboration with Jon „elmor“ Sandström. At the same time, the U-shaped design of the adapter enables optimised cable routing for clean cable management.

What does the WireView GPU do?
The WireView GPU enables the measurement of the power consumption of PCI expansion and plug-in cards and logs this data to determine the power consumption. This data can be used, among other things, to determine the power costs of a graphics card or to compare the power consumption with other graphics cards - and just plain looks cool!

- 1 x 8-Pins PCI-E - normal direction

Thermal Grizzly presents the WireView GPU, a device for measuring the power consumption of PCI expansion and plug-in cards, which was developed in collaboration with Jon „elmor“ Sandström. At the same time, the U-shaped design of the adapter enables optimised cable routing for clean cable management.

What does the WireView GPU do?
The WireView GPU enables the measurement of the power consumption of PCI expansion and plug-in cards and logs this data to determine the power consumption. This data can be used, among other things, to determine the power costs of a graphics card or to compare the power consumption with other graphics cards - and just plain looks cool!

- 1 x 16-Pins PCI-E - reversed direction

Thermal Grizzly presents the WireView GPU, a device for measuring the power consumption of PCI expansion and plug-in cards, which was developed in collaboration with Jon „elmor“ Sandström. At the same time, the U-shaped design of the adapter enables optimised cable routing for clean cable management.

What does the WireView GPU do?
The WireView GPU enables the measurement of the power consumption of PCI expansion and plug-in cards and logs this data to determine the power consumption. This data can be used, among other things, to determine the power costs of a graphics card or to compare the power consumption with other graphics cards - and just plain looks cool!

- 1 x 8-Pins PCI-E - reversed direction

Thermal Grizzly presents the WireView GPU, a device for measuring the power consumption of PCI expansion and plug-in cards, which was developed in collaboration with Jon „elmor“ Sandström. At the same time, the U-shaped design of the adapter enables optimised cable routing for clean cable management.

What does the WireView GPU do?
The WireView GPU enables the measurement of the power consumption of PCI expansion and plug-in cards and logs this data to determine the power consumption. This data can be used, among other things, to determine the power costs of a graphics card or to compare the power consumption with other graphics cards - and just plain looks cool!

- 2 x 8-Pins PCI-E - reversed direction

The AM5 Mycro Direct-Die is a water cooler for AMD's Ryzen 7000 processors that sits directly on the chiplets of a delidded CPU. Made of nickel-plated copper, the Direct-Die water cooler offers outstanding thermal conductivity. This is further increased by an optimized structure of the microfins on the top. In addition, compared to a normal water cooler, Direct-Die cooling eliminates a layer of thermal conductive material as well as the CPU's heatspreader. This significantly improves the heat transfer from the CPU to the water cooling circuit. The top part of the AM5 Mycro Direct-Die is made of CNC-machined polyoxymethylene (POM) and is equipped with one inlet and outlet each in the form of G1/4-inch threads.

Thermal pads offer extremely high thermal conductivity, outstanding compressibility, electrical insulation, and straightforward installation for efficient component cooling.

The Minus Pad Pro is the Pro-series thermal pad refined from the Minus Pad 8 to deliver improved thermal conductivity and compressibility for SSDs, GPU coolers, water blocks and electronic components.

• Excellent thermal conductivity


• Outstanding compressibility for tight contact


• Electrically non-conductive


• Easy to apply


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Designed to enhance heat transfer between components and cooling solutions in compact assemblies.

The Intel 1851 Delid-Die-Mate Heater V1 is a specially designed heating element for the Intel 1851 Delid-Die-Mate V1. The heater raises the temperature of both the CPU and the delidder to 165°C, the necessary temperature for delidding. The operation is controlled via a control unit with an OLED display, which is connected to the heater with two cables. A laptop/smartphone charger with at least 65 watts of power and a USB Type-C connector, which is not included, is required for the heater to operate. A small amount of thermal paste is also needed.

Heating element for warming the CPU
Designed for the Intel 1851 Delid-Die-Mate V1
Follow the warning instructions!
Scope of Delivery:

1x Intel 1851 Delid-Die-Mate Heater V1
1x Angle wrench
1x TG Cleaning Wipes
1x Kryonaut, 1g
Warning Instructions:

Note: When delidding with the Intel 1851 Delid-Die-Mate V1, the CPU should be heated to 165°C (the melting point of indium is 157°C) to liquefy the indium, making it easier to remove the heat spreader. This minimizes mechanical stress on the chip and helps prevent damage. Otherwise, there is a high risk that the CPU could be damaged during delidding.

Caution: delidding a CPU can be dangerous. Any damaged caused by this will not be covered by warranty. Make sure to ressearch how to before trying. 

Short back plate for AM5 motherboard, for mounting AM4 coolers with custom retaining kit on AM5, made from black anodised aluminium

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

The Intel 1851 Delid-Die-Mate V1 is a tool for removing the heat spreader (delidding) from Intel processors in the "Intel Core Ultra 200" series (LGA1851 socket). By removing the Integrated Heat Spreader (IHS), CPUs can be cooled using the "Direct-Die" method, where the cooler is mounted directly onto the processor chip. This enables the most efficient transfer of thermal dissipation power (TDP), or simply put, the heat, from the processor to the cooling loop.

 

Caution: Removing the heat spreader (delidding) of a processor is done at your own risk! Delidding the CPU voids the manufacturer's warranty! Damage caused during delidding is not covered by the manufacturer! CPU should be heated. 

Thermal pad biedt uitzonderlijk hoge samendrukbaarheid met uitstekende thermische geleidbaarheid, ontworpen om uiteenlopende hoogteverschillen over meerdere contactpunten te overbruggen.

TG Minus Pad High Compression is bijzonder praktisch voor het modificeren van grafische kaarten met een GPU-waterkoeler of het vervangen van thermal pads op een GPU-koeler, waarbij één type pad componenten zoals VRAM, spanningsregelaars en andere contactoppervlakken in dezelfde setup kan afdekken.

• Zeer hoge samendrukbaarheid
• Uitstekende thermische geleidbaarheid, zelfs onder zware compressie
• Past zich goed aan hoogte-toleranties aan
• Elektrisch niet-geleidend
• Eenvoudig te hanteren

Ideaal wanneer de exacte paddikte onzeker is; helpt betrouwbaar contact te behouden en compenseert toleranties.

Thermal pad levert hoge compressie, zeer hoge samendrukbaarheid en thermische geleidbaarheid in een elektrisch niet-geleidend ontwerp voor eenvoudige installatie.

Thermal Grizzly Minus Pad High Compression is ontworpen voor pc-enthousiastelingen en modders die een flexibel pad nodig hebben dat betrouwbaar hoogteverschillen tussen componenten compenseert zonder ingewikkelde metingen, en op maat kan worden gesneden voor een breed scala aan builds.

• Hoge samendrukbaarheid helpt hoogteverschillen te compenseren wanneer de exacte speling onbekend is
• Uitstekende thermische geleidbaarheid ondersteunt efficiënte warmte-uitwisseling
• Elektrisch niet-geleidend om kortsluiting in gevoelige elektronica te helpen voorkomen
• Veelzijdig inzetbaar voor SSD’s, laptops, VRM’s en grafische kaarten

Ideaal voor praktische koelupgrades waar tolerantie, veiligheid en eenvoudige verwerking belangrijk zijn.

Thermal pads offering extremely high thermal conductivity, outstanding compressibility and electrically non-conductive properties for use on SSDs, GPU coolers and electronic components.

The Minus Pad Pro combines excellent heat transfer with exceptional compressibility while remaining electrically non-conductive, making it suitable for cooling SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for tight contact


• Electrically non-conductive for safe use on electronics


• Easy to use


• Designed for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Based on the proven Minus Pad 8 and developed to further improve thermal conductivity and compressibility for reliable component cooling.

De Ryzen 7000 Delid-Die-Mate is een tool om veilig de heat spreader van de Ryzen 7000 processors te verwijderen. Door het verwijderen van de heat spreader kunnen de CPU's bijvoorbeeld worden gekoeld via Direct Die. Met Direct Die wordt de CPU-koeler direct op de CPU-chiplets en I/O-die gemonteerd, wat zorgt voor een aanzienlijk geoptimaliseerde warmteoverdracht.