Thermal Grizzly CPU koeler - pagina 3

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

The practical AM5 Adapter & Offset Mounting Kit for AMD‘s socket AM5 motherboards includes cooler brackets for offset mounting of the CPU as well as adapter screws from UNC 6-32 to M3 and M4 threads respectively. The adapter screws can be used to mount CPU coolers that require an M3 or M4 thread instead of the UNC 6-32 thread of the mounting screws of the cooler bracket, as is the case with various AIOs or water coolers. With the offset brackets, compatible CPU coolers can optionally be mounted offset on the processor to optimise cooling performance. Since the introduction of the chiplet design in Ryzen CPUs, the hottest point of the heat spreader is no longer in the middle, but has been offset slightly downwards and, depending on the CPU, towards the edge.

Thermal pad biedt uitzonderlijk hoge samendrukbaarheid met uitstekende thermische geleidbaarheid, ontworpen om uiteenlopende hoogteverschillen over meerdere contactpunten te overbruggen.

TG Minus Pad High Compression is bijzonder praktisch voor het modificeren van grafische kaarten met een GPU-waterkoeler of het vervangen van thermal pads op een GPU-koeler, waarbij één type pad componenten zoals VRAM, spanningsregelaars en andere contactoppervlakken in dezelfde setup kan afdekken.

• Zeer hoge samendrukbaarheid
• Uitstekende thermische geleidbaarheid, zelfs onder zware compressie
• Past zich goed aan hoogte-toleranties aan
• Elektrisch niet-geleidend
• Eenvoudig te hanteren

Ideaal wanneer de exacte paddikte onzeker is; helpt betrouwbaar contact te behouden en compenseert toleranties.

The Intel 1851 Delid-Die-Mate V1 is a tool for removing the heat spreader (delidding) from Intel processors in the "Intel Core Ultra 200" series (LGA1851 socket). By removing the Integrated Heat Spreader (IHS), CPUs can be cooled using the "Direct-Die" method, where the cooler is mounted directly onto the processor chip. This enables the most efficient transfer of thermal dissipation power (TDP), or simply put, the heat, from the processor to the cooling loop.

 

Caution: Removing the heat spreader (delidding) of a processor is done at your own risk! Delidding the CPU voids the manufacturer's warranty! Damage caused during delidding is not covered by the manufacturer! CPU should be heated. 

Thermal pad levert hoge compressie, zeer hoge samendrukbaarheid en thermische geleidbaarheid in een elektrisch niet-geleidend ontwerp voor eenvoudige installatie.

Thermal Grizzly Minus Pad High Compression is ontworpen voor pc-enthousiastelingen en modders die een flexibel pad nodig hebben dat betrouwbaar hoogteverschillen tussen componenten compenseert zonder ingewikkelde metingen, en op maat kan worden gesneden voor een breed scala aan builds.

• Hoge samendrukbaarheid helpt hoogteverschillen te compenseren wanneer de exacte speling onbekend is
• Uitstekende thermische geleidbaarheid ondersteunt efficiënte warmte-uitwisseling
• Elektrisch niet-geleidend om kortsluiting in gevoelige elektronica te helpen voorkomen
• Veelzijdig inzetbaar voor SSD’s, laptops, VRM’s en grafische kaarten

Ideaal voor praktische koelupgrades waar tolerantie, veiligheid en eenvoudige verwerking belangrijk zijn.

Thermal pads offering extremely high thermal conductivity, outstanding compressibility and electrically non-conductive properties for use on SSDs, GPU coolers and electronic components.

The Minus Pad Pro combines excellent heat transfer with exceptional compressibility while remaining electrically non-conductive, making it suitable for cooling SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for tight contact


• Electrically non-conductive for safe use on electronics


• Easy to use


• Designed for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Based on the proven Minus Pad 8 and developed to further improve thermal conductivity and compressibility for reliable component cooling.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

The Intel 1851 Delid-Die-Mate Heater V1 is a specially designed heating element for the Intel 1851 Delid-Die-Mate V1. The heater raises the temperature of both the CPU and the delidder to 165°C, the necessary temperature for delidding. The operation is controlled via a control unit with an OLED display, which is connected to the heater with two cables. A laptop/smartphone charger with at least 65 watts of power and a USB Type-C connector, which is not included, is required for the heater to operate. A small amount of thermal paste is also needed.

Heating element for warming the CPU
Designed for the Intel 1851 Delid-Die-Mate V1
Follow the warning instructions!
Scope of Delivery:

1x Intel 1851 Delid-Die-Mate Heater V1
1x Angle wrench
1x TG Cleaning Wipes
1x Kryonaut, 1g
Warning Instructions:

Note: When delidding with the Intel 1851 Delid-Die-Mate V1, the CPU should be heated to 165°C (the melting point of indium is 157°C) to liquefy the indium, making it easier to remove the heat spreader. This minimizes mechanical stress on the chip and helps prevent damage. Otherwise, there is a high risk that the CPU could be damaged during delidding.

Caution: delidding a CPU can be dangerous. Any damaged caused by this will not be covered by warranty. Make sure to ressearch how to before trying. 

Short back plate for AM5 motherboard, for mounting AM4 coolers with custom retaining kit on AM5, made from black anodised aluminium

Thermal pads offer extremely high thermal conductivity, outstanding compressibility, electrical insulation, and straightforward installation for efficient component cooling.

The Minus Pad Pro is the Pro-series thermal pad refined from the Minus Pad 8 to deliver improved thermal conductivity and compressibility for SSDs, GPU coolers, water blocks and electronic components.

• Excellent thermal conductivity


• Outstanding compressibility for tight contact


• Electrically non-conductive


• Easy to apply


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Designed to enhance heat transfer between components and cooling solutions in compact assemblies.

Thermische' plaat, thermische geleidbaarheid: 8 W (mK), 30 x 30 x 1 mm, verpakking van 1 stuk

Thermische pad, zwart (pak van 4)

Thermal pad with extremely high thermal conductivity and outstanding compressibility, electrically non-conductive and easy to apply for efficient heat transfer in electronic components.

The Minus Pad Pro builds on the proven Minus Pad 8 to deliver improved thermal performance and surface conformity, making it suitable for SSDs, GPU coolers, water-cooling blocks, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for better surface contact


• Electrically non-conductive


• Easy to use and install


• Designed for use with SSDs, GPUs, water coolers and electronic components


• Part of the Minus Pad Basic, Advance and Pro series; further developed from Minus Pad 8

Gray material adapts to uneven surfaces to improve contact between components and heatsinks for more reliable heat transfer.

De heatspreader van de Ryzen 7000-processors is erg dik, wat deels te wijten is aan de compatibiliteit met oudere CPU-koelers voor het AM4-socket. De onnodige dikte van de heatspreader vermindert de thermische geleidbaarheid, zodat de CPU's worden bediend bij zeer hoge temperaturen, die rond 95 graden Celsius liggen. Door het verwijderen van de heatspreader ("decapitating", "delidding"), kan de CPU-koeler direct op de chiplets van Ryzen 7000-CPU worden gemonteerd, waardoor temperaturen drastisch worden verminderd. Om schade aan gevoelige chips te voorkomen en problemen tijdens gebruik (bijv. RAM), vervangt het Ryzen 7000 Direct Die Frame mechanisme Socket Actuation Mechanism (SAM) op het moederbord.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal pad delivering excellent thermal conductivity and outstanding compressibility while remaining electrically non-conductive and easy to apply.

The Minus Pad Pro is part of the Minus Pad series, developed from the proven Minus Pad 8 to boost thermal performance and compressibility for components such as SSDs, GPU coolers, GPU water-cooling setups, voltage regulators and memory modules.

• Excellent thermal conductivity for efficient heat transfer


• Outstanding compressibility for tight-gap filling


• Electrically non-conductive for safe use on electronics


• Easy to use and install


• Color: gray

Provides a reliable thermal interface between electronic components and cooling solutions to enhance heat dissipation in compact assemblies.

Thermal Grizzly Minus Pad Extreme is a great choice for applications where renewing thermal paste is not an option. This is particularly useful when distances between the heat source and the heat sink need to be bridged - for example with memory chips and voltage converters. The silicone-based thermal pad has a consistency similar to modeling clay. Compared to Minus pad 8 the thermal conductivity was improved by about 260 %.

• Most excellent thermal conductivity
• No bleeding
• long-term stability
• high compression rate

The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm. See variants for various sizes and thickness. 

NB: Due to the consistency only one-time use is recommended 

Thermal pads uit de TG Minus Pad High Compression-serie combineren uitzonderlijk hoge samendrukbaarheid met uitstekende thermische geleidbaarheid, zelfs onder zware compressie.

Ontworpen om uiteenlopende hoogteverschillen te overbruggen, zijn deze pads vooral handig bij het modificeren van grafische kaarten met een GPU-waterkoeler of bij het vervangen van de thermal pads van een GPU-koeler, en helpen ze betrouwbaar contact te behouden over meerdere componenten binnen dezelfde setup.

• Past zich goed aan hoogte-toleranties aan
• Elektrisch niet-geleidend
• Zeer veelzijdig in toepassing
• Eenvoudig te hanteren

Ideaal wanneer de exact vereiste paddikte onbekend is, met thermische geleidbaarheid die zelfs kan toenemen bij hogere contactdruk.

Thermische plaat, thermische geleidbaarheid: 8 W (mK), 30 x 30 x 2 mm, verpakking van 1 stuk

De 12e generatie Lapping-Tool is speciaal ontworpen voor het Intel 12e generatie Contact Frame en vereenvoudigt het proces van het lappen van de processor. Met behulp van de bijgevoegde schroeven wordt de CPU eenvoudig op de Lapping-Tool gemonteerd met het Contact Frame. Dit simuleert de werkelijke uiteindelijke positie van de CPU in de socket op het moederbord.

Thermal pad delivering excellent thermal conductivity and outstanding compressibility for efficient heat transfer in SSDs, GPU coolers and other electronic components.

The Minus Pad Pro is an electrically non-conductive thermal pad developed to improve thermal conductivity and compressibility while remaining easy to apply.

• Excellent thermal conductivity


• Outstanding compressibility for reliable contact


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules

Easy-to-use design ensures consistent thermal contact across a range of cooling and electronic applications.

Thermal pad with extremely high thermal conductivity, outstanding compressibility and electrical non-conductivity for reliable heat transfer on SSDs, GPU coolers and electronic components.

The Minus Pad Pro is part of the Minus Pad series and builds on the proven Minus Pad 8 to deliver improved thermal conductivity and compressibility while remaining easy to use.

• Excellent thermal conductivity


• Outstanding compressibility


• Easy to use


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules


• Color: gray

Provides a compressible, electrically isolating interface to enhance thermal contact between components and cooling solutions.

Thermische' plaat, thermische geleidbaarheid: 8 W (mK), 30 x 30 x 1,5 mm, verpakking van 1 stuk