Thermal Grizzly CPU koeler - pagina 2

Thermal Grizzly TG Remove is een op aceton gebaseerde nanoreiniger voor de beste reinigingsresultaten van thermische pasta. Bovendien heeft TG Remove een ontvettend effect dat helpt bij het voorbereiden van het oppervlak voor nieuwe toepassingen, bijvoorbeeld op CPU's.

Digitale schuifmaat TG Caliper meet tot 150 mm / 6 inches met LCD-weergave in mm of inches, ZERO-functie en meting van buiten-, binnen-, stap- en dieptematen voor PC DIY-taken.

Gemaakt van ABS-kunststof met hoge hardheid; de schuifmaat is roestbestendig, stof- en spatwaterbestendig volgens IP54 en heeft een ergonomisch getextureerde duimsteun voor eenvoudiger gebruik.

• Resolutie/aflezing van 0.1 mm / 0.01 inch
• Nauwkeurigheid van ±0.2 mm / 0.01 inch
• Geschikt voor thermische pads, schroeven en buiswanddikte
• Werkt op LR44-batterij met reservebatterij inbegrepen

Met duidelijke digitale aflezingen en praktische meetfuncties helpt TG Caliper om nauwkeurige controles van PC DIY-componenten eenvoudig te maken.

Kapton Insulation Sheet is a polyamide film that can be used at high temperatures up to 280 degrees Celsius and acts as an assembly aid for electrically conductive thermal interface material (TIM). It is ideal for covering components such as SMDs on a CPU or GPU if they are to be used with Conductonaut liquid metal, Carbonaut or KryoSheet.

Brief Informations:

• 50 adhesive strips 10x60mm
• Thickness of 40µm
• Electrically insulating
• Max Temp: 280°C
• Breakdown voltage: Over 1 kV
• Clean the adhesive surface beforehand!

Scope of delivery

• 10x carrier foil with  5 Kapton Insulation Sheets each
   

Thermal Grizzly Duronaut is a high-performance thermal paste designed for excellent heat transfer and long-term stability.

Key features:
✔ Extremely durable
✔ High thermal conductivity
✔ Non-conductive & safe for electronics

Package includes:

1x Duronaut thermal paste 6g
1x Applicator
1x TG Spatula
1x TG Spatula Pro
 

Thermal paste, gray paste, thermal conductivity: 8.5 W (mK), 3.9 grams

Thermische plaat, thermische geleidbaarheid: 8 W (mK), 20 x 120 x 0,5 mm, verpakking van 2 stuks

Grease spatula (pak van 3)

Thermal pad with extremely high thermal conductivity, outstanding compressibility and electrical non-conductivity for reliable heat transfer on SSDs, GPU coolers and electronic components.

The Minus Pad Pro is part of the Minus Pad series and builds on the proven Minus Pad 8 to deliver improved thermal conductivity and compressibility while remaining easy to use.

• Excellent thermal conductivity


• Outstanding compressibility


• Easy to use


• Electrically non-conductive


• Suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules


• Color: gray

Provides a compressible, electrically isolating interface to enhance thermal contact between components and cooling solutions.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity


• High compressibility


• Easy to use


• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.


• Minus Pad Advance: Improved thermal conductivity, higher compressibility.


• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Thermal pad with extremely high thermal conductivity and outstanding compressibility, electrically non-conductive and easy to apply for efficient heat transfer in electronic components.

The Minus Pad Pro builds on the proven Minus Pad 8 to deliver improved thermal performance and surface conformity, making it suitable for SSDs, GPU coolers, water-cooling blocks, voltage regulators and memory modules.

• Excellent thermal conductivity


• Outstanding compressibility for better surface contact


• Electrically non-conductive


• Easy to use and install


• Designed for use with SSDs, GPUs, water coolers and electronic components


• Part of the Minus Pad Basic, Advance and Pro series; further developed from Minus Pad 8

Gray material adapts to uneven surfaces to improve contact between components and heatsinks for more reliable heat transfer.

Thermische pasta Thermal Grizzly Duronaut Pro biedt uitstekende thermische geleidbaarheid, extreme stabiliteit op lange termijn, elektrisch niet-geleidend gebruik en geen uitharding na verloop van tijd.

Duronaut Pro is een high-end thermische pasta ontwikkeld voor gamers, overclockers en veeleisende industriële koelsystemen, met siliconenolie met aluminium micropoeder en zinkoxide nanopoeder.

• Minimaliseert het pump-out-effect met geoptimaliseerde deeltjesvorm en -grootte
• Ondersteunt dunne aanbrenglagen voor lage thermische contactweerstand
• Inclusief applicator, TG Spatula en TG Spatula Pro
• Inhoud: 2 g

Ontworpen voor efficiënte warmteoverdracht tussen warmtebron en koeler; Duronaut Pro helpt betrouwbare koelprestaties in de loop van de tijd te behouden.

Thermal pad levert zeer hoge samendrukbaarheid met uitstekende thermische geleidbaarheid, ontworpen om uiteenlopende hoogteverschillen over meerdere contactpunten te overbruggen.

TG Minus Pad High Compression is bijzonder praktisch voor modificaties aan grafische kaarten met een GPU-waterkoeler of bij het vervangen van thermal pads van een GPU-koeler, omdat één pad componenten zoals VRAM, spanningsregelaars en andere contactoppervlakken in dezelfde setup kan bedienen—zelfs wanneer de exact vereiste dikte onbekend is.

• Behoudt thermische geleidbaarheid onder zware compressie, en kan zelfs toenemen bij hogere contactdruk
• Past zich goed aan hoogte-toleranties aan
• Elektrisch niet-geleidend
• Zeer veelzijdig en eenvoudig te hanteren

Helpt consistent contact en effectieve warmteoverdracht te garanderen over verschillende componenthoogtes.

The electrically non-conductive Minus Pad Advanced thermal pads are part of the Minus Pad Basic, Advance, and Pro series. Based on the proven minus pad 8, this series has been specifically further developed to significantly improve thermal conductivity, compressibility, and price-performance ratio. The thermal pads are suitable for SSDs, GPU coolers, GPU water coolers, as well as electronic components such as voltage regulators and memory modules.

• Excellent thermal conductivity
• High compressibility
• Easy to use
• Electrically non-conductive

Comparison of the Minus Pad Basic-, Advance-, and Pro series:

• Minus Pad Basic: Good thermal conductivity, slightly lower compressibility, and excellent price-performance ratio.
• Minus Pad Advance: Improved thermal conductivity, higher compressibility.
• Minus Pad Pro: Outstanding thermal conductivity and exceptional compressibility – at a slightly higher Price.
   

Thermische plaat, thermische geleidbaarheid: 8 W (mK), 20 x 120 x 2 mm, verpakking van 1 stuk

Thermal pads deliver electrically non-conductive heat transfer with improved thermal conductivity, high compressibility and straightforward application.

The Minus Pad Advance series builds on the proven Minus Pad 8 and offers enhanced thermal conductivity and compressibility compared to the Basic pads, suitable for SSDs, GPU coolers, GPU water coolers, voltage regulators and memory modules.

• Electrically non-conductive material


• Improved thermal conductivity


• High compressibility for uneven surfaces


• Easy to use and cut to size


• Size: 120 x 20 mm · Thickness: 2.0 mm · Color: black


• Pack content: 4 pcs

Ideal for reliable thermal coupling across a range of electronic components where consistent heat transfer is needed.

The PhaseSheet PTM is a thermal pad based on a phase change material (PCM). The pads, which are solid at room temperature, can be easily applied and liquefy during operation, allowing them to effectively dissipate heat like a thermal paste. PhaseSheet PTM is electrically non-conductive and can therefore be used in many areas, with the primary application being in processors and graphics chips.

Vloeibaar metaal thermische pasta applicator (pakket van 3)

Processor koelpasta, zilver

Thermische plaat, thermische geleidbaarheid: 8 W (mK), 100 x 100 x 1,5 mm, verpakking van 1 stuk

The Intel High Performance Heatspreader V1 is an upgrade heatspreader for Intel processors. The nickel-plated copper heatspreader has a 207 percent larger, diamond-milled precision surface. This increased surface area compared to the original heatspreader enables maximum heat dissipation for air and water coolers, while the precision milling ensures extremely low surface roughness for the best contact with the heat sink.

The Intel High Performance Heatspreader V1 is compatible with the following processors:

Intel 12th Gen CPUs
Intel 13th Gen CPUs
Intel 14th Gen CPUs (200s)

Scope of delivery

1x Intel High Performance Heatspreader V1
4x pan-head screws UNC thread 3/8"
1x hexagon socket wrench 5/64"
1x angle wrench Torx T20
 

Thermische' plaat, thermische geleidbaarheid: 8 W (mK), 100 x 100 x 0,5 mm, verpakking van 1 stuk

Thermische plaat, thermische geleidbaarheid: 8 W (mK), 100 x 100 x 1 mm, verpakking van 1 stuk

Thermally conductive gap filler to replace GPU thermal pads, with an operating temperature range of -40°C to +120°C.

TG Putty is a thermally conductive compound intended for GPU applications, offered in multiple sizes and performance variants.

• Replaces standard GPU thermal pads to bridge uneven surfaces


• Operating temperature: -40°C to +120°C


• Available contents: 30 g and 100 g


• Available variants: Basic, Advance, Pro


• Datasheet and technical information available for download

Ensures reliable thermal contact across gaps to support heat transfer between GPU components.

Water cooler optimized for Intel LGA1851 direct-die mounting with a nickel-plated copper microfin cold plate, low-flow-resistance jet channels and integrated RGB lighting.

The Intel 1851 Mycro Direct-Die Pro RGB V1 is designed to sit directly on a delidded Intel CPU to send heat straight into the water loop, with an acrylic-and-aluminum cover and controllable ARGB illumination.

• Direct-die installation for LGA1851 CPUs — requires removal of the ILM and CPU heatspreader; delidding is at your own risk


• Nickel-plated copper cold plate with microfins and a jet system, engineered for low flow resistance


• Acrylic layer tempered after milling to prevent stress cracks beneath the anodized aluminum lid


• Digital aRGB LEDs under the lid, controllable via a 3-pin ARGB header (+5V/DATA/GND); LEDs also illuminate the G1/4 fittings


• G1/4-inch female threading for standard fittings


• Tested with KryoSheet and thermal pads — additional pad thickness affected contact pressure and showed no significant temperature improvements

Built for users who want a compact direct cooling path from the CPU die into a water loop while retaining customizable RGB lighting.

CPU-montageframe maakt direct-die montage mogelijk voor AMD Ryzen 7000-processors op AM5 door de geïntegreerde heat spreader weg te laten, voor aanzienlijk lagere bedrijfstemperaturen.

Thermal Grizzly Ryzen 7000 Direct Die Frame laat je CPU-koeler direct contact maken met de chiplets van de processor voor efficiëntere warmteafvoer, terwijl het helpt de blootliggende chiplets te beschermen tegen contactdruk die de CPU-functie kan beïnvloeden.

• Compatibel met AMD Ryzen 7000 (incl. Ryzen 7000 V2)
• Maakt montage van delidded Ryzen-CPU's mogelijk
• Eenvoudige montage
• Geanodiseerde aluminium constructie in zwart

Ideaal voor extreme overclockers, gamers en content creators die betere koeling zoeken via directe warmteoverdracht.